We’re building a new generation of EDA tools for 3D integrated circuits. Grounded in physics. Designed for hardware acceleration. Built from the ground up.
Starting with thermal simulation. Thinking beyond it.
Our starting point is heat: how it moves through a stack, across materials, and between dies. Our ambition is broader—a connected set of physics tools that helps engineers make better decisions throughout the design process.
GPU thermal simulation for the structures that make 3D ICs possible. We study heat flow through stacked layers, material interfaces, and vertical interconnects to inform design choices.
We’re writing EDA tools from scratch for GPUs and other hardware accelerators. Algorithms, data structures, and workflows are designed around the hardware from the outset.
We’re working to extend our thermal expertise into other physical domains. The goal is an end-to-end design and verification platform that brings those perspectives together.
Research guides what we build. Measurement guides what we improve. We connect physical models, modern compute, and engineering validation in one development process.
Study research papers, technical documentation, and design specifications to define the right problems.
Turn physical models into algorithms and tools designed for parallel computation.
Check implementations against numerical tests and reference data. Measure accuracy and computational cost together.
Use what we learn to refine our tools and extend the platform beyond thermal simulation.
A growing toolset. A consistent foundation in physics.
We’d like to hear about your design challenges, research ideas, and the tools you wish existed.
For engineering conversations, research, and collaboration.